PACE Technologies WB-0035LC 3" Diamond Wafering Blade (Medium Grit, Low Concentration)

Precision wafer cutting is typically performed with diamond wafering blades. Optimal wafer cutting requires selecting the right abrasive concentration, abrasive size, cutting speed, and load. Precision wafering is essential for delicate samples or precise sectioning, with saw speeds ranging from 50-1500 rpm or 300-3000 rpm. High-speed saws are preferred for hard materials like ceramics, heat-treated steels, and minerals.

The most critical parameter in precision wafering is the abrasive size. Finer abrasives result in less damage, making them ideal for extremely brittle materials like semiconductors and ceramics. Precision wafering saws are used for delicate samples requiring exact cuts, with factors like abrasive concentration, blade grit, and cutting speed all playing crucial roles in achieving optimal results with minimal surface damage.

Applications:

• Hard/tougher ceramics (Si₃N₄, ZrO₂).