PACE Technologies SI-100A-16 SIAMAT Colloidal Silica Polishing Abrasive - 0.06 um (16 oz)

Colloidal silica slurries are essential in final polishing for applications requiring ultra-smooth, scratch-free surfaces, particularly in ceramics, composites, and soft metals. These suspensions offer chemical mechanical polishing (CMP) action, combining chemical reactivity with fine abrasive performance.

Stabilized at high alkaline pH levels (>9.5), colloidal silica contains nanoscale particles (0.05-0.07 µm) held in suspension by zeta potential. This creates an electrochemical environment that softens the surface, allowing the abrasives and polishing pad to remove material gently and uniformly.

The concentration of particles typically ranges between 25-50% solids. Even at these high concentrations, colloidal silica can be maintained in a nearly perfect suspension. The electrochemical stability of colloidal silica makes it an excellent chemical mechanical polishing abrasive for polishing ceramics. The main drawback to polishing with colloidal silica is that it will crystallize as it dehydrates. This is particularly troublesome around the lid of an open bottle. One way to reduce this crystallization is to add an ingredient to the colloidal silica suspension in order to reduce the evaporation rate of the water.

Ideal for precision polishing of ceramics, minerals, and sensitive alloys, colloidal silica improves removal rates and minimizes subsurface damage. For optimal performance, pre-wet the cloth, apply via a controlled drip or spray, and finish with a water rinse in the final 10-15 seconds to clear reactive residues and prevent crystallization.

Colloidal silica is often used as a standalone final abrasive or in conjunction with diamond slurries for enhanced results.