Overview
The PACE Technologies DIACUT diamond cutting fluids specifically formulated for precision metallographic sectioning. These fluids provide essential lubrication and cooling for diamond wafering blades to ensure deformation-free cuts. Protects specimen integrity by minimizing heat input and surface damage during low-speed cutting. Ideal for delicate samples such as electronics, ceramics, and composites when used with precision wafering systems.WL2-3000 (DIACUT 2 Anti-Corrosion): An enhanced water-based formula that includes specialized corrosion inhibitors. It is recommended for materials highly susceptible to oxidation or rust during the cutting process.