The PACE Technologies DIACUT diamond cutting fluids specifically formulated for precision metallographic sectioning. These fluids provide essential lubrication and cooling for diamond wafering blades to ensure deformation-free cuts. Protects specimen integrity by minimizing heat input and surface damage during low-speed cutting. Ideal for delicate samples such as electronics, ceramics, and composites when used with precision wafering systems.
WL-3000 (DIACUT Water-Based): This is the standard water-based fluid used for general precision cutting. It is designed to be non-corrosive and effective for most common materials.