Low-profile polyimide labels withstand wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.
Features:
- High temperature low profile labels are ideal for processes requiring thin or lighter weight materials
- Ultra-durable matte white polyimide material is thermal transfer printable
- UL approved and meets requirements of MIL-STD-202G, Method 215K
- Service temperature of -94° to 212°F (-70° to 100°C)
- A ribbon is required to print this material. Use Part Number B30-R6000
For more information, please see Data Sheet