PACE Technologies ATTO-1000S Controlled Removal Quantitative Grinding Machine

The ATTO-1000S delivers micron-level precision for quantitative grinding and polishing of semiconductor wafers, optical components, integrated circuits, and metallographic samples. Engineered for parallel grinding, quantitative thinning, and continuous slicing with real-time monitoring and 0.2 micron resolution. Ideal for SEM, FIB, TEM, AFM, EBSD, and petrographic analysis.

Features:

• Quantitative material removal with real-time monitoring and 0.2 micron resolution
• Micron-level accuracy for parallel grinding, polishing, and quantitative thinning
• 7-inch touchscreen with programmable process parameter storage for repeatable results
• Micrometer-adjustable pitch and roll control with variable oscillation and rotation

For more information, please see Brochure